Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration

Prasad Bhosale; J. Maniscalco; Nicholas A. Lanzillo; T. Nogami; D. Canaperi; K. Motoyama; Huai Huang; P. McLaughlin; Roey Shaviv; M. Stolfi

doi:10.1109/iitc.2018.8430474

Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration

Identifier:nobleid.org/w1/20260515/194C0179

Type:Journal Article

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Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration

Identifier:nobleid.org/w1/20260515/194C0179

Type:Journal Article

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