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Adhesion of Chemical Vapor Deposited Boron Carbo-nitride to Dielectric and Copper Films

Identifier:nobleid.org/w1/20260515/35D0CF98

Type:Journal Article

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Edward Engbrecht

P. R. Fitzpatrick

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Adhesion of Chemical Vapor Deposited Boron Carbo-nitride to Dielectric and Copper Films | NobleID