Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

Kyungjun Cho; Joungho Kim; Youngwoo Kim; Subin Kim; Hyunwook Park; Junyong Park; Seongsoo Lee; Daeyong Shim; Kangseol Lee; Sangmook Oh

doi:10.1109/tcpmt.2019.2895083

Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

Identifier:nobleid.org/w1/20260515/64EC1ADA

Type:Journal Article

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Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

Identifier:nobleid.org/w1/20260515/64EC1ADA

Type:Journal Article

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