Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill

A. Leśniewska; Ph. Roussel; Davide Tierno; V. Vega Gonzalez; Marleen H. van der Veen; Patrick Verdonck; N. Jourdan; Christopher Wilson; Zs. Tôkei; Kristof Croes

doi:10.1109/irps45951.2020.9129246

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill

Identifier:nobleid.org/w1/20260515/65FCEC87

Type:Journal Article

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Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill

Identifier:nobleid.org/w1/20260515/65FCEC87

Type:Journal Article

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