3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019)

Xiaoxiang Wu; Haiguang Ma; Han Yin; Danfeng Pan; Junzhuan Wang; Linwei Yu; Jun Xu; Yi Shi; Kunji Chen

doi:10.1002/aelm.201970034

3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019)

Identifier:nobleid.org/w1/20260515/68BBC755

Type:Journal Article

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3D Electronics: 3D Sidewall Integration of Ultrahigh‐Density Silicon Nanowires for Stacked Channel Electronics (Adv. Electron. Mater. 7/2019)

Identifier:nobleid.org/w1/20260515/68BBC755

Type:Journal Article

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