Origin of compressive residual stress in polycrystalline thin films. | NobleID

Main

Mint Work Search Explore Works Knowledge Graph Citation Graph Bibliometrics Receipts

v1

Origin of compressive residual stress in polycrystalline thin films.

NobleID: NI2P49W05R06S80
Persistent link: https://nobleid.org/ark:/48914/w1/20260515/973050AF

Type:Journal Article

0 views

Support unavailableClaim Your Authorship

Embeddable Badge

[![NobleID](https://www.nobleid.org/api/badge/973050AF.svg?ark=w1%2F20260515%2F973050AF&value=id)](https://nobleid.org/work/w1/20260515/973050AF)

ARK Inflections

Metadata Policy

Metadata Formats

Bibliometric Analysis

Impact metrics, research fronts, co-authorship networks →

Authors & Claims

Paper Authors

Claim authorship of this work

info@nobleid.org

About FAQ Terms Policy Persistence & Resolver Service Policy