(Invited) Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras | NobleID

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(Invited) Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras

Identifier:nobleid.org/w1/20260515/AE77EB91

Type:Journal Article

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Matthieu Fortin‐Deschênes

Oussama Moutanabbir

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