In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Zhongquan Liao; Martin Gall; Kong Boon Yeap; Christoph Sander; Uwe Mühle; Jürgen Gluch; Yvonne Standke; Oliver Aubel; Norman Vogel; Meike Hauschildt

doi:10.1016/j.mee.2014.09.014

In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Identifier:nobleid.org/w1/20260515/AF033F1D

Type:Journal Article

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In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Identifier:nobleid.org/w1/20260515/AF033F1D

Type:Journal Article

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