缓冲层Ta对退火Co/Cu/Co薄膜微观结构和界面互扩散的影响 | NobleID

Main

Mint Work Search Explore Works Knowledge Graph Citation Graph Bibliometrics Receipts

v1

缓冲层Ta对退火Co/Cu/Co薄膜微观结构和界面互扩散的影响

Identifier:nobleid.org/w1/20260515/CF59596E

Type:Journal Article

0 views

Support unavailableClaim Your Authorship

Embeddable Badge

[![NobleID](https://www.nobleid.org/api/badge/CF59596E.svg?ark=w1%2F20260515%2FCF59596E)](https://nobleid.org/work/w1/20260515/CF59596E)

ARK Inflections

Metadata Policy

Metadata Formats

Bibliometric Analysis

Impact metrics, research fronts, co-authorship networks →

Authors & Claims

Paper Authors

Claim authorship of this work

info@nobleid.org

About FAQ Terms Policy Persistence & Resolver Service Policy