Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding

Chagnon, Dany; Işık, Dilek; Lévesque, Pierre L.; Lewis, François; Caza, Marie-Ève; Le, Xuan Tuan; Poirier, Jean-Sébastien; Michel, Damien; Larger, Ronan; Moutanabbir, Oussama

doi:10.1149/ma2014-02/34/1741

Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding

NobleIDNI8P81W79R54S98

Type:Journal Article

0 views

Claim Your Authorship

Embeddable Badge

[![NobleID](https://www.nobleid.org/api/badge/EB9ECA44.svg?ark=w1%2F20260525%2FEB9ECA44&value=id)](https://nobleid.org/work/w1/20260525/EB9ECA44)

ARK Inflections

Metadata (JSON)Policy

Metadata Formats

Bibliometric Analysis

Impact metrics, research fronts, co-authorship networks →

Authors & Claims

Paper Authors

Jean-Sébastien Poirier

Damien Michel

Ronan Larger

Oussama Moutanabbir

Claim authorship of this work

Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding

NobleIDNI8P81W79R54S98

Type:Journal Article

0 views

Claim Your Authorship

Embeddable Badge

[![NobleID](https://www.nobleid.org/api/badge/EB9ECA44.svg?ark=w1%2F20260525%2FEB9ECA44&value=id)](https://nobleid.org/work/w1/20260525/EB9ECA44)

ARK Inflections

Metadata (JSON)Policy

Metadata Formats

Bibliometric Analysis

Impact metrics, research fronts, co-authorship networks →

Authors & Claims

Paper Authors

Jean-Sébastien Poirier

Damien Michel

Ronan Larger

Oussama Moutanabbir

Claim authorship of this work